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PIC18F2480/2580/4480/4580
DS39637D-page 6
2009 Microchip Technology Inc.
Table of Contents
1.0
Device Overview .......................................................................................................................................................................... 9
2.0
Guidelines for Getting Started with PIC18F Microcontrollers ..................................................................................................... 25
3.0
Oscillator Configurations ............................................................................................................................................................ 29
4.0
Power-Managed Modes ............................................................................................................................................................. 39
5.0
Reset .......................................................................................................................................................................................... 47
6.0
Memory Organization ................................................................................................................................................................. 67
7.0
Flash Program Memory............................................................................................................................................................ 101
Data EEPROM Memory ........................................................................................................................................................... 111
9.0
8 x 8 Hardware Multiplier.......................................................................................................................................................... 117
10.0 Interrupts .................................................................................................................................................................................. 119
11.0 I/O Ports ................................................................................................................................................................................... 135
12.0 Timer0 Module ......................................................................................................................................................................... 151
13.0 Timer1 Module ......................................................................................................................................................................... 155
14.0 Timer2 Module ......................................................................................................................................................................... 161
15.0 Timer3 Module ......................................................................................................................................................................... 163
16.0 Capture/Compare/PWM (CCP) Modules ................................................................................................................................. 167
17.0 Enhanced Capture/Compare/PWM (ECCP) Module................................................................................................................ 177
18.0 Master Synchronous Serial Port (MSSP) Module .................................................................................................................... 191
19.0 Enhanced Universal Synchronous Receiver Transmitter (EUSART) ....................................................................................... 231
20.0 10-Bit Analog-to-Digital Converter (A/D) Module ..................................................................................................................... 253
21.0 Comparator Module.................................................................................................................................................................. 263
22.0 Comparator Voltage Reference Module................................................................................................................................... 269
23.0 High/Low-Voltage Detect (HLVD)............................................................................................................................................. 273
24.0 ECAN Module........................................................................................................................................................................... 279
25.0 Special Features of the CPU.................................................................................................................................................... 349
26.0 Instruction Set Summary .......................................................................................................................................................... 367
27.0 Development Support............................................................................................................................................................... 417
28.0 Electrical Characteristics .......................................................................................................................................................... 421
29.0 Packaging Information.............................................................................................................................................................. 459
Appendix A: Revision History............................................................................................................................................................. 471
Appendix B: Device Differences......................................................................................................................................................... 471
Appendix C: Conversion Considerations ........................................................................................................................................... 472
Appendix D: Migration from Baseline to Enhanced Devices.............................................................................................................. 472
Appendix E: Migration From Mid-Range to Enhanced Devices ......................................................................................................... 473
Appendix F: Migration From High-End to Enhanced Devices............................................................................................................ 473
The Microchip Web Site ..................................................................................................................................................................... 487
Customer Change Notification Service .............................................................................................................................................. 487
Customer Support .............................................................................................................................................................................. 487
Reader Response .............................................................................................................................................................................. 488
PIC18F2480/2580/4480/4580 Product Identification System ............................................................................................................ 489
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PIC18F4580-I/PT-ND 制造商: 功能描述: 制造商:undefined 功能描述:
PIC18F4580T-I/ML 功能描述:8位微控制器 -MCU 32 KB FL 1536 RAM 36 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4580T-I/PT 功能描述:8位微控制器 -MCU 32 KB FL 1536 RAM 36 I/O RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4585-E/ML 功能描述:8位微控制器 -MCU 48KB 3328 RAM w/ECAN RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4585-E/P 功能描述:8位微控制器 -MCU 48KB 3328 RAM w/ECAN RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4585-E/PT 功能描述:8位微控制器 -MCU 48KB 3328 RAM w/ECAN RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4585-H/ML 功能描述:8位微控制器 -MCU 48 KB Flash 3328 RAM 36 I/O w/ECAN RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
PIC18F4585-H/P 功能描述:8位微控制器 -MCU 48 KB Flash 3328 RAM 36 I/O w/ECAN RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT